| Rosemont, IL, September 26, 2006 – Speedline Technologies unveils its new VectraES wave soldering system
at ATExpo, booth #5702. The VectraES is the latest example of the firms continued commitment and
leadership to the traditional in-line wave soldering market.
New VectraES Wave Soldering System
Speedline’s VectraES wave soldering system is the latest addition to Electrovert’s wave soldering product line
as it joins the industry recognized VectraElite™ and Electra™ platforms. The VectraES provides exceptional
system-wide accessibility, an advanced control system, and innovative sub-system technologies designed for
today’s lead-free environment. The VectraES will soon become the wave soldering system of choice for low to
medium production environments as it provides an ideal balance between system performance, functionality,
and low cost of ownership.
In addition to its new VectraES platform, Speedline will be highlighting new subsystem technologies during this
years show.
•ServoSpray™ Launched at ATExpo 2006
ServoSpray from Speedline Electrovert complements the company’s spray fluxer product lineup; the
industry’s most comprehensive offering. This servo-controlled reciprocating spray fluxing system features
an air atomized spray head, pressure tank flux supply system, self-cleaning nozzle capability, and the
ability to spray in one or both directions via recipe control. The system provides Speedline Electrovert
customers with a cost effective method of applying flux as it delivers positive hole penetration and spray
uniformity for a wide range of fluxes at a competitive price.
•Low Mass Forced Convection Preheat Technology Launched at ATExpo 2006
The VectraES will feature Speedline Electrovert’s latest in preheat technology; its Low Mass Forced
Convection preheat module. This easily accessible one-piece module provides exceptional thermal
performance, ensuring minimized cross board as well as top to bottom product delta T’s.
•UltraFill™ Nozzle Technology
At 40% wider than the traditional tin/lead nozzles, the UltraFill Nozzle increases both contact length and
dwell time. Additionally, for dual wave applications, the spacing between the chip and laminar nozzle is
reduced, resulting in less temperature drop between the two waves.
With the addition of the Nitrogen Shroud, the UltraFill Nozzle may be run in an air or nitrogen environment
as determined by the specified recipe (no need to change nozzles). The shroud lifts for easy maintenance
and dedrossing – without nozzle removal.
The resulting benefits of the UltraFill Nozzle include; reduced bridging, reduced dross generation, reduced
maintenance, and improved hole fill.
Speedline Electrovert’s UltraFill Nozzle is today’s industry benchmark when it comes to lead-free nozzle
technology.?Speedline VectraES at ATExpo 2006, Page 2
For more information, visit Speedline Technologies at ATExpo in booth #5702, or contact your Speedline
distributor or representative. Reach Speedline Technologies directly at 1-508-520-0083 or
http://www.speedlinetech.com.
About Speedline Technologies
Speedline Technologies is the global leader in process knowledge and expertise for the PCB assembly and semiconductor
industries. Based in Franklin, Massachusetts, U.S.A., the company markets five best-in-class brands — Accel
microelectronics cleaning equipment; Camalot dispensing systems; Electrovert wave soldering, reflow soldering, and cleaning equipment; MPM stencil and screen printing systems; and Protect global services, support, and training solutions.
Speedline Technologies is Frost & Sullivan’s “2005 Surface Mount Technology Company of the Year.”
For more information, visit: http://www.speedlinetech.com |
